CX1825-01
BLE Node Sensor Board

BLE Module

  • Ezurio (Laird) BL654

    • Nordic Semiconductor nRF52840 BLE SoC

    • Integrated antenna for wireless connectivity

    • Bluetooth 5.2 support

    • 1MB Flash + 256KB RAM

    • ARM Cortex-M4F processor at 64MHz

    • Integrated USB 2.0 controller

    • Secure boot loader and cryptographic accelerator

Onboard Sensors

  • ST HTS221TR Temperature and Humidity Sensor

    • Measures relative humidity with ±3.5% RH accuracy and temperature with ±0.5°C accuracy.

  • ST LPS22HBTR Absolute Pressure Sensor

    • Measures barometric pressure from 260 to 1260 hPa with ±0.1 hPa accuracy.

  • Avago APDS-9960 Ambient Light, RGB, Proximity, and Gesture Sensor

    • Detects ambient light intensity, color, proximity, and gestures.

  • ST LIS3DHTR 3-Axis Accelerometer

    • Measures acceleration in three axes (X, Y, Z) with selectable measurement ranges of ±2g, ±4g, ±8g, or ±16g.

  • Melexis MLX90248ESE Hall Effect Sensor

    • Detects magnetic fields and provides digital output, ideal for position sensing and contactless switches.

  • TDK Invensense ICS-41350 MEMS Microphone

    • High-performance, low-power digital microphone with omnidirectional sensitivity and flat frequency response.

The board also features a QWIIC connector for easy expansion with additional I2C sensors, enabling plug-and-play compatibility and streamlining the process of adding new sensing capabilities to projects.

User Interface

  • RGB LED, driven by a dedicated TI LP5521YQX LED driver.

  • Discrete red and green LEDs for visual indicators.

  • PUI Audio buzzer for audible alerts.

  • User and reset buttons.

Power Management

  • Battery-powered by both Li-Ion/Li-Po and coin cell

  • USB-B for power and Li-Ion/Li-Po battery charger.

  • 3.3V LDO regulator for stable power supply.

  • JST Connector for Li-Ion/Li-Po batteries.

  • Coin cell battery holder.

Connectivity Options

  • USB Micro-B receptacle for power and data communication.

  • 2x5 pin SWD header

  • Expansion headers for access to GPIO, I2C, and power pins, enabling custom integrations and rapid prototyping.

PCB Specifications

  • Compact dimensions of 40mm x 40mm.

  • 4-layer PCB stack-up for improved signal integrity and EMI reduction.

  • One side SMD components.